Electroless Nickel Immersion Gold

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Electroless Nickel Immersion Gold (or ENIG for short) is a surface treatment method of pcb:s that uses gold over nickel to protect the copper surface and create a surface suitable for soldering. As the surface isn't required to last for any mechanical wear the thickness of the gold layer is quite thin even if it looks impressive.

A board with ENIG on it will have the gold dissolved into solder wherever there is a solder connection. If the solder is removed with acid the gold will drop as a very fine black powder that takes a long time to settle.



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