Bond wire

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A BGA chip with exposed bond wires in the plastic.

Bond wires are the wires that connect a silicon die to the conductors in the IC package or directly to a circuit board. The bond wires forms the electrical connection between the die and the more robust outer package. They are commonly made from gold or aluminum. In rare cases silver or copper might be used too. The die and bond wires are then covered by plastics or encased inside a closed cavity to protect it. Not all IC:s have bond wires.

The wires are very thin, from 15 µm up to hundreds of µm.



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